IPC SM-839 PDF

Description

IPC SM-839 – Pre and Post Solder Mask Application Cleaning Guidelines

Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control and maintenance of cleanliness during pre-assembly processes.

Product Details

Published:

04/01/1990

Number of Pages:

29

File Size:

1 file , 130 KB

Product Code(s):

SM-839(D)1

Note:

This product is unavailable in Russia, Ukraine, Belarus