IPC PERM-WP-022 PDF

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White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report

Published by Publication Date Number of Pages
IPC 09/05/2018 28
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IPC PERM-WP-022 – White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report

IPC-PERM-WP-022: Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with re-owed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT re-ow process. This phenomenon of tin replacement during SMT re-ow has been termed “self-mitigation”, because the components mitigate themselves without the need of any special additional processing. Self-mitigation has many advantages over other forms of tin mitigation as it is highly effective, adds no additional cost and subjects the components to no additional handling.

A round robin study has been performed by IPC/PERM Task group 8-81, during which identical sets of test vehicles were assembled, in accordance with IPC J-STD-001, Class 3, at multiple locations. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.

Product Details

Published:
09/05/2018
ISBN(s):
9781611934137
Number of Pages:
28
File Size:
1 file , 1 MB
Note:
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