IPC J-STD-033D PDF

Description

IPC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Product Details

Published:

03/01/2018

Number of Pages:

32

File Size:

1 file , 2.4 MB

Product Code(s):

J033-STD-0-D-0-EN-D, J033-STD-0-D-0-EN-D

Note:

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