IPC J-STD-013 PDF

Description

IPC J-STD-013 – Implementation of Ball Grid Array and Other High Density Technology

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.

Product Details

Published:

08/01/1996

Number of Pages:

123

File Size:

1 file , 1.3 MB

Product Code(s):

J-013(D)1

Note:

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