IPC J-STD-013 – Implementation of Ball Grid Array and Other High Density Technology
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.
Product Details
Published:
08/01/1996
Number of Pages:
123
File Size:
1 file , 1.3 MB
Product Code(s):
J-013(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
