IPC DD-135 – Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
Product Details
Published:
08/01/1995
Number of Pages:
36
File Size:
1 file , 370 KB
Product Code(s):
DD-135(D)1
Note:
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