IPC DD-135 PDF

Description

IPC DD-135 – Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

Product Details

Published:

08/01/1995

Number of Pages:

36

File Size:

1 file , 370 KB

Product Code(s):

DD-135(D)1

Note:

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