IPC 9707 – Spherical Bend Test Method for Characterization of Board Level Interconnects
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component’s board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.
Product Details
- Published:
- 09/01/2011
- Number of Pages:
- 24
- File Size:
- 1 file , 2.4 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
