IPC 7095D-WAM1 PDF

IPC 7095D-WAM1 – Design and Assembly Process Implementation for BGAs, Includes Amendment 1

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

Product Details

Published:

06/01/2019

Number of Pages:

208

File Size:

1 file , 13 MB

Product Code(s):

7095-STD-0-D-W1-EN-D, 7095-STD-0-D-W1-CN-D, 7095-STD-0-D-W1-JP-D, 7095-STD-0-D-W1-EN-D

Note:

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