IPC 7092A PDF

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Design and Assembly Process Implementation for Embedded Circuitry

Published by	Publication Date	Number of Pages
IPC	10/01/2022	124

Category: IPC

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Description

IPC 7092 – Revision A – Design and Assembly Process Implementation for Embedded Circuitry

IPC 7092 describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.