IPC 2614 – Sectional Requirements for Board Fabrication Documentation
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
Product Details
Published:
03/01/2010
Number of Pages:
59
File Size:
1 file , 2.3 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
