IPC 2225 – Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
Product Details
Published:
05/01/1998
ANSI:
ANSI Approved
Number of Pages:
44
File Size:
1 file , 590 KB
Product Code(s):
2225(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
