IPC 0040 – Optoelectronics Assembly and Packaging Technology
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner in which these parts will become an integral part of the functioning module, board or subassembly.
Product Details
Published:
05/01/2003
Number of Pages:
161
File Size:
1 file , 2.5 MB
Product Code(s):
0040(D)1
Note:
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