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PIP ELEGS01 – Grounding and Bonding Guidelines [Technical Correction]

This Practice addresses the reasons and methods for the grounding and bonding of electrical systems and equipment within a process industry environment. IEEE, NEMA, and UL documents form the basis of this guideline. IEC methods and terminology are not addressed in this guideline. This Practice addresses system voltages through 34.5 kV. Refer to the requirements of IEEE Std. 80 for grounding of system voltages above 34.5 kV. This Practice does not address the grounding of DC systems as covered by IEEE Std. 142, uninterruptible power systems as covered in IEEE Std. 142, or temporary protective grounding associated with NFPA 70E. Refer to PIP ELEGL05 for lightning and static protective systems. This Practice does not address the grounding of instrumentation systems and electronic equipment. Section 4.2.3 of this Practice and PIP ELEGS01-F can aid in the installation of the grounding electrode system associated with instrument systems and electronic equipment. This Practice does not cover installation methods for grounding and bonding systems. These installation methods are addressed in PIP ELIGD000 and industry standards such as NFPA 70, UL 647, and IEC documents. Figures are provided as diagrammatical representations of grounding connections and not intended to represent actual field termination connections.