JEDEC JESD22-B118 PDF

Description

This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.

Product Details

Published:

03/01/2011

Number of Pages:

18

File Size:

1 file , 770 KB

Note:

This product is unavailable in Russia, Ukraine, Belarus