JEDEC JESD22-B112A PDF

JEDEC JESD22-B112A PDF

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PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

Published by Publication Date Number of Pages
JEDEC 10/01/2009 30
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Description

JEDEC JESD22-B112A – PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

Product Details

Published:
10/01/2009
Number of Pages:
30
File Size:
1 file , 1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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