JEDEC JESD22-B106D PDF

Description

This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.

Product Details

Published:

04/01/2008

Number of Pages:

12

File Size:

1 file , 70 KB

Note:

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