JEDEC JESD22-B105E PDF

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Lead Integrity

Published by Publication Date Number of Pages
JEDEC 02/01/2018 22
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JEDEC JESD22-B105E – Lead Integrity

This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. For hermetic packages it is recommend that this test be followed by hermeticity tests in accordance with Test Method A109 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. These tests, including each of its test conditions, is considered destructive and is only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Product Details

Published:
02/01/2018
Number of Pages:
22
File Size:
1 file , 120 KB
Note:
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