JEDEC JESD22-A122 PDF

Description

This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.

Product Details

Published:

08/01/2007

Number of Pages:

17

File Size:

1 file , 140 KB

Note:

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