JEDEC JEP167A PDF

Description

JEDEC JEP167A – Characterization of Interfacial Adhesion in Semiconductor Packages

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

Product Details

Published:

11/01/2020

Number of Pages:

32

File Size:

1 file , 390 KB

Redline File Size:

2 files , 3.8 MB

Note:

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