IPC J-STD-033C PDF

IPC J-STD-033C PDF

$47.00

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 02/01/2012

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Description

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented.

Product Details

Published:
02/01/2012
Number of Pages:
28
File Size:
1 file , 710 KB
Note:
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