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Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices standard by Association Connecting Electronics Industries, 03/01/2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
Product Details
Published:
03/01/2008
Number of Pages:
24
File Size:
1 file , 190 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
