IPC J-STD-020B PDF

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Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 07/01/2002

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Updated & ANSI Approved! This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead-free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation. Developed by IPC and JEDEC.

Product Details

Published:
07/01/2002
Number of Pages:
12
File Size:
1 file , 130 KB
Note:
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