The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification.
Product Details
Published:
04/01/1999
Number of Pages:
19
File Size:
1 file , 170 KB
Part of:
IPC M109, IPC 9500-K
Product Code(s):
9503(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
