This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
Product Details
Published:
10/01/2011
Number of Pages:
36
File Size:
1 file , 2.1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
