This new document provides guides for the design and fabrication of stencils for solder paste andsurface-mount adhesive. This is the first time this important information has been collected andpublished in an industry consensus document. Stencil design for various surface-mounttechnology, as well as mixed technology with through-hole or flip chip components is discussed;this includes overprint, two-print and step stencil designs. A sample order form and a userinspection checklist are also included.
Product Details
Published:
05/01/2000
Number of Pages:
20
File Size:
1 file , 330 KB
Product Code(s):
7525(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
