IPC 4101B PDF
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Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
standard by Association Connecting Electronics Industries, 06/01/2006
This specification covers the requirements for base materials (laminate and prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 separate specification sheets and now uses search terms to allow the user to find similar groups of materials from these specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those assembly practices that utilize the now commonly-encountered lead free solders.
Product Details
- Published:
- 06/01/2006
- Number of Pages:
- 112
- File Size:
- 1 file , 600 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
