IEEE 1838 PDF

Original price was: $99.00.Current price is: $59.00.

IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

Published by Publication Date Number of Pages
IEEE 03/13/2020 0
PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

IEEE 1838 – IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

New IEEE Standard – Active.IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding

Product Details

Published:
03/13/2020
ISBN(s):
9781504465526, 9781504463430, 9781504463447
Number of Pages:
0
File Size:
1 file , 3.8 MB
Product Code(s):
STD23997, STDPD23997, STDPL23997
Note:
This product is unavailable in Russia, Ukraine, Belarus