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IEC 62878-2-602 Ed. 1.0 b PDF
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Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
| Published by | Publication Date | Number of Pages |
| IEC | 06/01/2021 | 28 |
IEC 62878-2-602 Ed. 1.0 b – Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Product Details
- Edition:
- 1.0
- Published:
- 06/01/2021
- ISBN(s):
- 9782832298947
- Number of Pages:
- 28
- File Size:
- 1 file , 4.9 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
