IEC 62878-1 Ed. 1.0 b:2019 PDF
$80.00
Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
standard by International Electrotechnical Commission, 10/14/2019
Description
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
Product Details
- Edition:
- 1.0
- Published:
- 10/14/2019
- Number of Pages:
- 38
- File Size:
- 1 file , 1.6 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus