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Device embedding assembly technology – Part 1: Generic specification for device embedded substrates standard by International Electrotechnical Commission, 10/14/2019
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
Product Details
Edition:
1.0
Published:
10/14/2019
Number of Pages:
38
File Size:
1 file , 1.6 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
