IEC 62258-5 Ed. 1.0 b PDF

Description

IEC 62258-5 Ed. 1.0 b – Semiconductor die products – Part 5: Requirements for information concerning electrical simulation

IEC 62258-5:2006 has been developed to facilitate the production, supply and use of semiconductor die products, including:
– wafers;
– singulated bare die;
– die and wafers with attached connection structures;
– minimally or partially encapsulated die and wafers.
This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

This publication is to be read in conjunction withIEC 62258-1:2009 and IEC 62258-2:2011.

Product Details

Edition:

1.0

Published:

08/29/2006

Number of Pages:

24

File Size:

1 file , 260 KB

Note:

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