IEC 62047-2 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
Product Details
- Edition:
- 1.0
- Published:
- 08/15/2006
- Number of Pages:
- 25
- File Size:
- 1 file , 470 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
