IEC 62047-10 Ed. 1.0 b PDF

IEC 62047-10 Ed. 1.0 b PDF

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Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials

Published by Publication Date Number of Pages
IEC 07/26/2011 22
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IEC 62047-10 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.

Product Details

Edition:
1.0
Published:
07/26/2011
Number of Pages:
22
File Size:
1 file , 350 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus

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