IEC 61191-3 Ed. 2.0 en:2017 PDF
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Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
standard by International Electrotechnical Commission, 05/30/2017
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
Product Details
- Edition:
- 2.0
- Published:
- 05/30/2017
- Number of Pages:
- 20
- File Size:
- 1 file , 470 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
