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Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies standard by International Electrotechnical Commission, 08/28/1998
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Product Details
Edition:
1.0
Published:
08/28/1998
Number of Pages:
31
File Size:
1 file , 530 KB
Note:
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