IEC 61191-3 Ed. 1.0 b:1998 PDF

IEC 61191-3 Ed. 1.0 b:1998 PDF

$49.00

Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
standard by International Electrotechnical Commission, 08/28/1998

Preview
PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

Description

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Product Details

Edition:
1.0
Published:
08/28/1998
Number of Pages:
31
File Size:
1 file , 530 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus

In Demand Now