IEC 61190-1-1 Ed. 1.0 b – Attachment materials for electronic assembly – Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
Product Details
Edition:
1.0
Published:
03/25/2002
Number of Pages:
41
File Size:
1 file , 570 KB
Note:
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