IEC 61188-5-8 Ed. 1.0 en:2007 PDF
Original price was: $77.00.$46.00Current price is: $46.00.
Printed board and printed board assemblies – Design and use – Part 5-8: Attachment (land/joint) considerations – Area array components (BGA, FBGA, CGA, LGA)
standard by International Electrotechnical Commission, 10/30/2007
Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.
Product Details
- Edition:
- 1.0
- Published:
- 10/30/2007
- Number of Pages:
- 30
- File Size:
- 1 file , 1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
