IEC 60749-25 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Product Details
Edition:
1.0
Published:
07/11/2003
Number of Pages:
25
File Size:
1 file , 650 KB
Note:
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