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Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20 Ed. 3.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Product Details
Edition:
3.0
Published:
08/01/2020
ISBN(s):
9782832287279
Number of Pages:
60
File Size:
1 file , 2.5 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
