IEC 60749-16 Ed. 1.0 b PDF

Description

IEC 60749-16 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 16: Particle impact noise detection (PIND)

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Product Details

Edition:

1.0

Published:

01/17/2003

Number of Pages:

13

File Size:

1 file , 200 KB

Note:

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