IEC 60749-15 Ed. 3.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Product Details
Edition:
3.0
Published:
07/14/2020
Number of Pages:
17
File Size:
1 file , 1000 KB
Note:
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