IEC 60749-15 Ed. 3.0 b PDF

Description

IEC 60749-15 Ed. 3.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices

IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

Product Details

Edition:

3.0

Published:

07/14/2020

Number of Pages:

17

File Size:

1 file , 1000 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus