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Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices standard by International Electrotechnical Commission, 02/07/2003
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
Product Details
Edition:
1.0
Published:
02/07/2003
Number of Pages:
11
File Size:
1 file , 230 KB
Note:
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