IEC 60512-6-2 Ed. 1.0 b PDF

Description

IEC 60512-6-2 Ed. 1.0 b – Connectors for electronic equipment – Tests and measurements – Part 6-2: Dynamic stress tests – Test 6b: Bump

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

Product Details

Edition:

1.0

Published:

02/21/2002

Number of Pages:

9

File Size:

1 file , 400 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus