IEC 60191-6-8 Ed. 1.0 en:2001 PDF
$37.00
Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)
standard by International Electrotechnical Commission, 08/27/2001
Description
Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.
Product Details
- Edition:
- 1.0
- Published:
- 08/27/2001
- Number of Pages:
- 10
- File Size:
- 1 file , 260 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus