IEC 60191-6-8 Ed. 1.0 b PDF

Description

IEC 60191-6-8 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Product Details

Edition:

1.0

Published:

08/27/2001

Number of Pages:

22

File Size:

1 file , 330 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus