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Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-5 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA)
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Product Details
Edition:
1.0
Published:
08/27/2001
Number of Pages:
10
File Size:
1 file , 330 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
