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Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
IEC 60191-6-17 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Product Details
Edition:
1.0
Published:
01/27/2011
Number of Pages:
53
File Size:
1 file , 640 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
