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Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for gull-wing lead terminals
IEC 60191-6-1 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for gull-wing lead terminals
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
Product Details
Edition:
1.0
Published:
10/30/2001
Number of Pages:
7
File Size:
1 file , 230 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
