IEC 60191-5 Ed. 2.0 b PDF

Description

IEC 60191-5 Ed. 2.0 b – Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Product Details

Edition:

2.0

Published:

04/23/1997

Number of Pages:

71

File Size:

1 file , 570 KB

Note:

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