IEC 60191-4 Ed. 2.2 b PDF

IEC 60191-4 Ed. 2.2 b PDF

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Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

Published by Publication Date Number of Pages
IEC 10/22/2002 43
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IEC 60191-4 Ed. 2.2 b – Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

Product Details

Edition:
2.2
Published:
10/22/2002
Number of Pages:
43
File Size:
1 file , 610 KB
Note:
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