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BS 3934-5 PDF
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Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
Published by | Publication Date | Number of Pages |
BSI | 09/15/1997 | 38 |
BS 3934-5 – Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
Product Details
- Published:
- 09/15/1997
- ISBN(s):
- 0580278123
- Number of Pages:
- 38
- File Size:
- 1 file , 940 KB
- Product Code(s):
- 01094344, 01094344, 01094344
- Note:
- This product is unavailable in Ukraine, Russia, Belarus