JEDEC JEP156 PDF
$40.00
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
standard by JEDEC Solid State Technology Association, 03/01/2009
Description
This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.
Product Details
- Published:
- 03/01/2009
- Number of Pages:
- 24
- File Size:
- 1 file , 150 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus